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OIP232-1170 Series-D4

Product Features

Supports one or two 1st or 2nd Generation Intel® Xeon® Scalable processors;

Supports 24 DDR4 memory slots, with memory speeds of 2400/2666/2933 MHz;

Modular design offering various configuration options for PCIe and hard drives;

Supports multiple PCIe 3.0 expansion slots;

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Product Specifications

Product Specifications 2U Rack Server (24 DIMMs / 12 Drive Bays)
Compute and Memory
Product Form 2U rackmount; 24 DIMM slots and 12 front drive bays.
CPU Intel® Xeon® 6226R processor.
Memory 24 DIMM slots. Supports DDR4 LRDIMM / RDIMM 2400 / 2666 / 2933 MHz; standard 256 GB, expandable to 1 TB.
Storage, Expansion and Network
Drive Bays Front: up to 12 hot-swappable 3.5 / 2.5 in SAS, SATA, or NVMe drives. Rear: optional two 2 × 3.5 in drive modules or two 2 × 2.5 in drive modules.
PCIe Slots 4 × half-height PCIe 3.0 x16 slots and 2 × half-height PCIe 3.0 x8 slots.
Network Onboard 2 × 1000 Mb Ethernet ports and independent 2 × 10000 Mb Ethernet ports. Optional 10 Gb network card with optical module.
I/O, Reliability and Management
External I/O

Front: 1 × VGA and 2 × USB 3.0.

Rear: 1 × VGA, 1 × COM, 2 × USB 3.0, 1 × RJ45 Gigabit management port, and 2 × Gigabit RJ45 business-network ports.

Fans 4 × 8038 hot-swappable N+1 redundant fans; optional 8056 hot-swappable N+1 redundant fans.
Power Supply Redundant AC 220 V 550 W / 800 W / 1300 W / 1600 W / 2000 W / 2200 W power supplies, selected according to actual power requirements.
Management 1 dedicated RJ45 management port with remote management and IPMI 2.0 support.
Physical and Environmental
Chassis 2U rackmount, 748 × 433.4 × 87.6 mm (D × W × H).
Rails Standard rail kit × 1.
Operating Temperature / Humidity 5°C to 35°C; 20% to 80% RH, non-condensing.
Storage Temperature / Humidity

Short-term storage (≤ 72 h): −40°C to 70°C; 20% to 90% RH, non-condensing, including packaging.

Long-term storage (> 72 h): 20°C to 28°C; 30% to 70% RH, non-condensing, including packaging.

Specifications are for reference only and subject to the actual product configuration.